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By James J. Licari,Dale W. Swanson

This publication is exclusive in its complete insurance of all elements of adhesive know-how for microelectronic units and packaging, from concept to bonding to check methods. as well as normal purposes, comparable to dies, substrate, and lid and chip stack attachments, the publication contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing equipment equivalent to UV, microwave, and moisture (which agree to present environmental and effort specifications) are coated. Over eighty tables and a hundred and twenty figures supply a wealth of knowledge on houses, functionality, and reliability. additionally integrated are examples of commercially on hand adhesives, providers, and kit. every one bankruptcy presents finished references.

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By James J. Licari,Dale W. Swanson

This publication is exclusive in its complete insurance of all elements of adhesive know-how for microelectronic units and packaging, from concept to bonding to check methods. as well as normal purposes, comparable to dies, substrate, and lid and chip stack attachments, the publication contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing equipment equivalent to UV, microwave, and moisture (which agree to present environmental and effort specifications) are coated. Over eighty tables and a hundred and twenty figures supply a wealth of knowledge on houses, functionality, and reliability. additionally integrated are examples of commercially on hand adhesives, providers, and kit. every one bankruptcy presents finished references.

Show description

Read or Download Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) PDF

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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